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dc.contributor.advisorSaha, Dr. Pran Kanai
dc.contributor.authorIslam, Fahmida
dc.contributor.authorSultana, Samiha
dc.contributor.authorSultana, Maria
dc.date.accessioned2016-09-20T07:20:33Z
dc.date.available2016-09-20T07:20:33Z
dc.date.copyright2016
dc.date.issued2016
dc.identifier.otherID 12121035
dc.identifier.otherID 13321085
dc.identifier.otherID 13321082
dc.identifier.urihttp://hdl.handle.net/10361/6427
dc.descriptionThis thesis report is submitted in partial fulfillment of the requirements for the degree of Bachelor of Science in Electrical and Electronic Engineering, 2016.en_US
dc.descriptionCataloged from PDF version of thesis report.
dc.descriptionIncludes bibliographical references (page 52-53).
dc.description.abstractIn this age of compressed CMOS technology, due to stringent systems requirements in power, performance, and fundamental physical limitations, future ULSI systems are relying more on ultra-high data rates, scalable, re-configurable highly compact and reliable inter-connect fabric. To suppress these fundamental limits a RF/Wireless inter-connect concept is proposed for future inter/ intra chip communications. The RF/Wireless interconnect is based on low loss and dispersion free microwave signal transmission using near field capacitive coupling with multiple access. Recent advances in wireless interconnect in different potential applications will be reviewed. Based on these developments and on the basis of the reviews future inter/ intra ULSI interconnect system will be proposed and analyzed in this thesis project.en_US
dc.description.statementofresponsibilityFahmida Islam
dc.description.statementofresponsibilitySamiha Sultana
dc.description.statementofresponsibilityMaria Sultana
dc.format.extent53 pages
dc.language.isoenen_US
dc.publisherBRAC Universityen_US
dc.rightsBRAC University thesis are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission.
dc.subjectWireless interconnecten_US
dc.subjectCMOS technologyen_US
dc.subjectULSI systemsen_US
dc.titleWireless interconnect for future ULSIen_US
dc.typeThesisen_US
dc.contributor.departmentDepartment of Electrical and Electronic Engineering, BRAC University
dc.description.degreeB. Electrical and Electronic Engineering


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