Wireless interconnect for future ULSI
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BRAC University
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Abstract
In this age of compressed CMOS technology, due to stringent systems requirements in power, performance, and fundamental physical limitations, future ULSI systems are relying more on ultra-high data rates, scalable, re-configurable highly compact and reliable inter-connect fabric. To suppress these fundamental limits a RF/Wireless inter-connect concept is proposed for future inter/ intra chip communications. The RF/Wireless interconnect is based on low loss and dispersion free microwave signal transmission using near field capacitive coupling with multiple access. Recent advances in wireless interconnect in different potential applications will be reviewed. Based on these developments and on the basis of the reviews future inter/ intra ULSI interconnect system will be proposed and analyzed in this thesis project.
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Cataloged from PDF version of thesis report.
Includes bibliographical references (page 52-53).
This thesis report is submitted in partial fulfillment of the requirements for the degree of Bachelor of Science in Electrical and Electronic Engineering, 2016.
Includes bibliographical references (page 52-53).
This thesis report is submitted in partial fulfillment of the requirements for the degree of Bachelor of Science in Electrical and Electronic Engineering, 2016.
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Thesis