Figure of merit analysis of nanostructured thermoelectric materials at room temperature

bracu.type.groupResearch Publications
datacite.rightsMetadata Only
dc.contributor.authorHossain, M. Mobassar
dc.contributor.authorAhmed, Shabab A.
dc.contributor.authorShahriar, Shafat Md.
dc.contributor.authorZzaman, Md. S. U.
dc.contributor.authorDas, Avijit
dc.contributor.authorSaha, Atanu K.
dc.contributor.authorHossain Bhuian, Md. Belal
dc.contributor.departmentDepartment of Electrical and Electronic Engineering
dc.date.accessioned2026-07-29T04:14:50Z
dc.date.available2026-07-29T04:14:50Z
dc.date.issued2017-11-21
dc.description.abstractIn this paper, we mainly focused on analyzing the thermoelectric property i.e. figure of merit of different nanostructured materials in room temperature (300-310 K). Here we studied the transition-metal dichalcogenides, particularly Molybdenum Disulfide (MoS2); Metal Oxides, specifically Zinc Oxide (ZnO); and conventional semiconductor materials, i.e. n-type and p-type Silicon (Si) and Silicon Germanium (SiGe). At first, we calculated the electrical conductance (Ge), by using electronic density functional theory (DFT). Similarly, we calculated the thermal conductance (?) using Tersoff empirical potential (TEP) model. With these calculated values of Ge and ? and the Seebeck coefficient (S), we calculated the figure of merit (ZT) at different room temperatures. The main findings of our research were the increased ZT of MoS2, which is slightly larger than p-type Si while, 2?3 times larger than ZnO and 100?103 times larger than conventionally used SiGe and n-type Si at room temperatures. We have further investigated a thermoelectric generator (TEG) device with these materials to validate our result.
dc.description.versionPublished
dc.format.extent139-144
dc.identifier.citationM. M. Hossain et al., "Figure of merit analysis of nanostructured thermoelectric materials at room temperature," 2017 IEEE 17th International Conference on Nanotechnology (IEEE-NANO), Pittsburgh, PA, USA, 2017, pp. 139-144, doi: 10.1109/NANO.2017.8117430.
dc.identifier.doi10.1109/NANO.2017.8117430
dc.identifier.issn9781509030286
dc.identifier.other2-s2.0-85041193341
dc.identifier.urihttps://hdl.handle.net/10361/28670
dc.language.isoen_US
dc.publisherInstitute of Electrical and Electronics Engineers Inc.
dc.relation.hasversion10.1109/NANO.2017.8117430
dc.relation.ispartof2017 IEEE 17th International Conference on Nanotechnology Nano 2017
dc.relation.ispartofseries2017 IEEE 17th International Conference on Nanotechnology Nano 2017
dc.relation.urihttps://ieeexplore.ieee.org/document/8117430
dc.rightsfalse
dc.subjectSilicon
dc.subjectThermal conductivity
dc.subjectSilicon germanium
dc.subjectMolybdenum
dc.subjectZinc oxide
dc.subjectTemperature
dc.subjectII-VI semiconductor materials
dc.subject.lcshCompound semiconductors.
dc.subject.lcshMolybdenum.
dc.subject.lcshThermal conductivity.
dc.subject.lcshSilicon.
dc.titleFigure of merit analysis of nanostructured thermoelectric materials at room temperature
dc.typeConference Proceeding
person.affiliation.nameBRAC University
person.affiliation.nameBRAC University
person.affiliation.nameBRAC University
person.affiliation.nameBRAC University
person.affiliation.nameBRAC University
person.affiliation.namePenn State College of Engineering
person.affiliation.nameBRAC University
person.identifier.scopus-author-id59036181000
person.identifier.scopus-author-id57206715619
person.identifier.scopus-author-id57218797702
person.identifier.scopus-author-id59502479200
person.identifier.scopus-author-id57209610229
person.identifier.scopus-author-id59067757500
person.identifier.scopus-author-id59158375700

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